Post by account_disabled on Mar 16, 2024 8:15:13 GMT 1
The requirements. This includes selected colors such as white color or brightness lighting angle etc. Some manufacturers also consider the chip's reliability and durability. Once chips are purchased they must be inspected and selected to ensure they meet manufacturing standards. Unqualified chips will be discarded to ensure the quality of the final product. support structure of the light strip on which chips and other electronic components are mounted. The substrate preparation process includes design etching drilling and soldering. Substrate design needs to consider chip layout circuit connections and power supplies.
Once the design is complete the substrate will be fabricated to fit the size and shape of the light strip. Packaging Materials and Conductive Threads Purchasing Chips typically B2B Sale Lead require packaging to protect them from environmental influences and provide adequate optical properties. Encapsulation materials and leads must also be purchased during the manufacturing process of the light strip. The encapsulation material is usually transparent to ensure that light can be emitted efficiently while wires connect the chip to the power source. The procurement and preparation of these raw materials is the first step in light strip production and the basis of the product. The next section describes chip processing and preparation.
Chip Processing and Preparation After the chip has been purchased and inspected, the next step is to process and prepare it to make it suitable for light strip production. The chip processing and preparation process is shown in the figure below. Chip selection and classification are usually purchased in large quantities from suppliers and need to be selected and classified to ensure that the optoelectronic parameters of the chips are similar. This step typically involves using photoelectric measuring instruments to measure parameters such as brightness, color temperature, and luminous angle. for each chip. The chips are then divided into different groups based on these parameters for subsequent assembly processes. Granulation Granulation is an important step in chip
Once the design is complete the substrate will be fabricated to fit the size and shape of the light strip. Packaging Materials and Conductive Threads Purchasing Chips typically B2B Sale Lead require packaging to protect them from environmental influences and provide adequate optical properties. Encapsulation materials and leads must also be purchased during the manufacturing process of the light strip. The encapsulation material is usually transparent to ensure that light can be emitted efficiently while wires connect the chip to the power source. The procurement and preparation of these raw materials is the first step in light strip production and the basis of the product. The next section describes chip processing and preparation.
Chip Processing and Preparation After the chip has been purchased and inspected, the next step is to process and prepare it to make it suitable for light strip production. The chip processing and preparation process is shown in the figure below. Chip selection and classification are usually purchased in large quantities from suppliers and need to be selected and classified to ensure that the optoelectronic parameters of the chips are similar. This step typically involves using photoelectric measuring instruments to measure parameters such as brightness, color temperature, and luminous angle. for each chip. The chips are then divided into different groups based on these parameters for subsequent assembly processes. Granulation Granulation is an important step in chip